力冠突破|山東力冠12英寸爐管設備賦能半導體產業升級
2026-03-10
自2013年創立以來,公司從4英寸爐管設備起步,腳踏實地,先后完成6英寸、8英寸設備的自主研發與迭代,最終實現12英寸爐管設備的全系列覆蓋,公司以完整的產品矩陣躋身大尺寸半導體裝備國產化陣營,為中國半導體產業的自主可控注入強勁力量。
12英寸全系列設備重磅亮相
經過十三年來的技術沉淀與創新突破,山東力冠精準把握行業發展趨勢,經過1000多個日夜持續的技術攻堅,10000多個小時的測試驗證,最終攻克大尺寸設備核心技術瓶頸,全面覆蓋集成電路、先進封裝等核心應用領域,適配多種材料,可滿足多樣化工藝需求。

· 12英寸氧化/合金/退火設備:
適用于氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、合金(Alloy)等工藝。
· 12英寸LPCVD設備:
適用于氮化硅(SiN)、多晶硅(Poly-Si/U-Poly/D-Poly)、二氧化硅(TEOS)、HTO等工藝。
· 12英寸ALD設備:
適用于氮化硅(SiN)、二氧化硅(SiO2)等膜層的沉積。
作為山東省“專精特新中小企業”“瞪羚企業”,山東力冠憑借扎實的技術積累,已斬獲多項行業榮譽,產品不僅覆蓋國內市場,更出口中國臺灣、新加坡、歐美等國家,獲得全球客戶的認可。
未來,山東力冠將持續深耕半導體裝備領域,不斷推進技術迭代與產品升級,在鞏固12英寸爐管設備全覆蓋優勢的基礎上,積極向更高工藝制程、更先進半導體裝備研發進軍,助力中國半導體產業突破瓶頸、實現高質量發展,朝著成為世界級半導體行業領導者的目標不斷邁進。
Liguan Breakthrough: Shandong liguan Empowers Semiconductor Upgrade, Conquering the Large-Size Equipment Peak.
Shandong Liguan Embarks on a New Journey! Recently, Shandong Liguan Microelectronic Equipment Co., Ltd. has successfully expanded into the 12-inch semiconductor core equipment sector, launching a full series of 12-inch equipment for Oxidation/Alloy/Annealing/LPCVD/ALD processes.
Since its inception in 2013, the company began with 4-inch vertical furnace systems and has steadily advanced, achieving independent R&D and iterative upgrades for 6-inch and 8-inch tools. Now, with full-series coverage of 12-inch vertical furnace equipment, Shandong Liguan has established itself as a key player in the domestic large-wafer semiconductor equipment landscape, providing robust support for China's pursuit of self-sufficiency and control over its semiconductor supply chain.
Focusing on the Core Track: 12-Inch Full-Series Equipment Makes a Grand Debut
After 13 years of technological accumulation and innovation breakthroughs, Shandong Liguan has precisely grasped industry development trends. Through over 1,000 days and nights of continuous technical and more than 10,000 hours of testing and validation, the company has finally overcome the core technical bottlenecks of large-size equipment. Its products now comprehensively cover core application areas such as integrated circuits and advanced packaging, are compatible with various materials, and can meet diverse process requirements.
Highlights of Core Equipment
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12-Inch Oxidation/Alloy/Annealing Equipment: Suitable for processes such as Oxidation, Annealing, Polyimide curing, and Alloy.
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12-Inch LPCVD Equipment: Suitable for processes involving Silicon Nitride (SiN), Polysilicon (Poly-Si/U-Poly/D-Poly), Silicon Dioxide (TEOS), HTO, etc.
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12-Inch ALD Equipment: Suitable for depositing film layers such as Silicon Nitride (SiN) and Silicon Dioxide (SiO2).
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